PCB Assembly Process Common Issues

The process of mounting components onto a circuit board is known as PCB assembly and is an important part of the electronic equipment manufacturing process. Some considerations need special attention during the PCBA process to ensure product quality and productivity. We will discuss the most common problems during PCB assembly in this blog.

Design Related Issues

The design phase is important for the PCB Assembly Process. The design phase should consider insufficient spacing between components, poor thermal management, and improper placement of vias and traces. The following points need to be noted in the design phase:

Insufficient Spacing

When the spacing between the components is insufficient, solder connects with the adjacent components unintentionally and this can lead to short circuits.

Poor Thermal Management

Another commonly encountered issue during the assembly process is poor thermal management, which can lead to overheating of the components. In the worst cases, it can lead to component damage.

Improper placement of vias and traces

The improper placement of via and traces can interfere with the soldering process, which can lead to poor connections. On the other hand, thin traces are not capable of handling the required current load and therefore, can lead to potential failures.

PCB circuit board design

PCB circuit board design needs to consider the size of the components, layout, line direction, and connection methods. The design needs to follow certain layout rules to avoid interference between components and ensure the stability and reliability of the circuit board.


Electrostatic interference needs to be prevented during PCB design and manufacturing. In the operation process, use anti-static gloves static mats, and other anti-static measures to avoid damage to components.

Component Related Issues

There are several common issues encountered during the PCB assembly process.

Incorrect Component Placement

During the PCB assembly process, errors in component placement can occur due to human mistakes or inaccuracies in automated machines. These inaccurate placements of components result in open or short circuits and can affect the overall functionality of the PCB.

Defective Components

Defective components are one of the commonly occurring issues in the PCB assembly process. Defective components fail to meet the specified performance criteria and may have manufacturing flaws which leads to poor functionality and overall performance of the PCB.

Soldering Problems

One of the critical processes in PCB assembly is the soldering process. In this process, several common issues occur including cold joints, solder bridging, and insufficient solder. Cold joints usually occur, when the solder does not completely wet the component leads and pads of the PCB, which leads to weak connections. Solder bridging occurs when excess solder creates unintentional links between pads and leads, which results in short circuits. Similarly, insufficient solder can lead to poor conductivity and mechanical strength.

Missing Components

Another common but critical issue in the PCB assembly process is the failure to place the required components on the board due to oversight or the possible error in the Bill of Material (BOM). Therefore, missing components lead to functional failure of the PCB.

Component Damage

Component damage is also one of the common issues encountered in the PCB assembly process. Component damage can happen due to several reasons including physical mishandling, mechanical stress, exposure to excessive heat, and electrostatic discharge (ESD)

Component Tolerances

Variations in tolerances of components such as resistances, capacitance, and voltage ratings can affect the overall performance of the PCB. In precision and high-frequency applications, tolerances may introduce uncertainties in the circuit behaviors.

Manufacturing Process Issues

There are many manufacturing process issues commonly encountered during the PCB assembly process.

Solder Paste Application Issue

If the solder paste is not applied evenly to all pads, it can result in weak solder joints. Similarly, misalignment of the stencil with the PCB during solder paste application results in an incorrect deposit of solder paste, which leads to bridging and insufficient solder on pads.
In reflow soldering, a precise temperature is required. So, too high temperature can cause the components damage and too low temperature can cause cold joints as the solder has not melted properly.
In wave soldering, problems such as voids or excessive solder can occur due to improper wave height or speed, which leads to poor solder joints. Components can be exposed to thermal shock with insufficient preheating, and excessive preheating can even cause component damage.

Handling & Assembly line issues

Sensitive components’ improper handling can cause physical damage to components or lead to electrostatic discharge (ESD) damage.

Quality inspection

In PCB assembly, quality inspection is required, including the quality of component soldering and line connection. In the inspection process, it is necessary to use professional testing instruments and equipment to ensure product quality and reliability.
During the encapsulation phase of the PCBA processing and manufacturing process, the following points need to be observed.

Selection of encapsulation materials

The selection of encapsulation materials needs to be determined according to the performance requirements of the product and the use of the environment, such as high temperature, heat, dust, etc.

Temperature and time control in the encapsulation process

We need to pay attention to controlling temperature and time in the encapsulation process, to avoid too high a temperature or too long a time leading to failure of the encapsulation material or product performance degradation.

Sealing of encapsulation

The encapsulation sealing is crucial to the stability and reliability of the product and needs to be ensured in the encapsulation process.

Test Issues

In the test phase of the PCBA processing and production process, you need to pay attention to the following points:

Selection of test instruments and equipment

We also need to select test instruments and equipment according to the performance and specifications of the product. This will ensure the accuracy and reliability of the test results.

Setting of test parameters

The setting of test parameters needs to be determined according to the performance requirements and specifications of the product. This ensures the accuracy and reliability of the test results.

Determination and recording of test results

The determination and recording of test results need to be strictly per the product test standards to ensure the accuracy and reliability of the test results.

Environmental & Handling Issues

The environment and handling are very critical in the PCB assembly process and several factors contribute to environmental & handling issues such as humidity and moisture control, temperature variations, cleaning & contamination, and air quality and particulates.

Humidity & Moisture Control

If the assembly environment has no humidity & moisture control, it causes the components to absorb the moisture, which leads to soldering issues such as balling and voiding.

Temperature Variations

Controlled temperature is required in any assembly environment. Extreme temperatures cause thermal expansion and contraction, which stresses solder joints.

Cleaning & Contamination

The most common issues in the assembly process are cleaning and contamination. Flux residues, dust, and other contaminants can affect the electrical performance of components.

Air Quality & particulates

In the assembly area, if the air quality is poor with high contamination of particulates, it can lead to issues such as incomplete solder joints.

PCB Assembly Issues Mitigation Strategies

These strategies can be used to overcome the problems that often occur during assembly: proper spacing between components, proper thermal management, training of PCB assembly personnel, routine inspections of equipment and machinery, and humidity and moisture-controlled environments. Implementing these measures ensures that the final product meets all quality standards.


In conclusion, it is essential to understand the common issues in the PCB assembly process for producing high-quality products. Each issue in the PCB design assembly is crucial and by implementing best practices and control measures, one can ensure the performance and reliability of their PCBs.

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